4/15 Webinar "Flexible Substrates for 5G/6G"
Flexible substrates that are essential from smartphones to high-speed communication devices. From the basics of LCP-FCCL to low dielectric and multilayer FPC formation processes.
■Title: "Flexible Substrates and FPC Formation Technology for 5G/6G - LCP-FCCL and Its Development" ――A must-see for developers of high-frequency FPCs. Provides knowledge useful for future FPC substrate design, from the key technologies for LCP multilayering to examples of new low-dielectric films. ■Date and Time: April 15, 2026 (Wednesday) 13:30 - 16:30 ■Target Audience for the Seminar Development engineers engaged in the development of high-frequency FPCs and their substrates ■Knowledge Gained from the Seminar ・Basic characteristics required for FPC substrates ・Reasons why LCP and polyimide films are used in FPCs ・Key technologies for LCP multilayering ・Points to consider when processing LCP films ・Examples of hybridization methods between LCP and low-dielectric materials
- 企業：CMC RESEARCH Ltd.
- 価格：Other
